Magnetic media access head with metal coating

ABSTRACT

Embodiments disclosed herein provide magnetic media access heads with metal coatings. In a particular embodiment, a magnetic media head for accessing magnetic media comprises a base substrate configured to support a magnetic head layer. The magnetic head layer is formed on the base substrate and configured to magnetically access the magnetic media. A metallic layer formed over the magnetic head layer and disposed between the magnetic head layer and the magnetic media when the magnetic media is positioned for access by the magnetic head layer.

RELATED APPLICATIONS

This application is a continuation of U.S. Pat. No. 8,934,197, entitled“MAGNETIC MEDIA ACCESS HEAD WITH METAL COATING,” filed on Jul. 16, 2012,and which is hereby incorporated by reference in their entirety.

TECHNICAL BACKGROUND

Magnetic media has been used for decades because it can reliably storelarge amounts of data for long periods of time. Magnetic tapes, inparticular, are able to store very large amounts of data and arerelatively inexpensive when compared to the costs of other magnetic andnon-magnetic storage mediums. Hence, even though magnetic tape requiressequential access, which usually does not allow quick access to dataitems stored thereon, magnetic tape is a very efficient way to back uplarge amounts of data as a failsafe for faster storage mediums, such asmagnetic hard disk drives.

When data is read from or written to magnetic tape, a magnetic tape headmust contact the magnetic tape as the magnetic tape passes over themagnetic tape head. This contact causes friction that wears on themagnetic tape head. Over time the magnetic tape head wears down to thepoint that the magnetic tape head can no longer access the magnetic tapeand needs to be replaced.

To extend the life of magnetic tape heads, coatings made of insulatingmaterials have been used. While these insulating coatings do provide acertain amount protection from wear for magnetic tape heads, theinsulating materials are still insufficiently durable. Thus, even withthe insulating coatings, magnetic tape heads need to be replacedrelatively frequently.

OVERVIEW

Embodiments disclosed herein provide magnetic media access heads withmetal coatings. In a particular embodiment, a magnetic media head foraccessing magnetic media comprises a base substrate configured tosupport a magnetic head layer. The magnetic head layer is formed on thebase substrate and configured to magnetically access the magnetic media.A metallic layer formed over the magnetic head layer and disposedbetween the magnetic head layer and the magnetic media when the magneticmedia is positioned for access by the magnetic head layer.

In some embodiments, the metallic layer prevents contact between themagnetic head layer and the magnetic media to prevent wear on themagnetic head layer.

In some embodiments, the magnetic media comprises magnetic tape.

In some embodiments, the magnetic media comprises a magnetic disk.

In some embodiments, an insulator layer is formed between the magnetichead layer and the metallic layer.

In some embodiments, the metallic layer is composed of titanium,platinum, tungsten, or any other metal or metal alloy.

In some embodiments, the metallic layer is from 1 nanometer to 20nanometers in thickness.

In some embodiments, magnetically accessing the magnetic media comprisesreading data from or writing data to the magnetic media.

In a further embodiment, a method is provided of operating a magneticmedia head for accessing magnetic media. The method comprises providingthe magnetic media head comprising a base substrate configured tosupport a magnetic head layer, the magnetic head layer formed on thebase substrate and configured to magnetically access the magnetic media,and a metallic layer formed over the magnetic head layer and disposedbetween the magnetic head layer and the magnetic media when the magneticmedia is positioned for access by the magnetic head layer. The methodfurther comprises positioning the magnetic media for access by themagnetic head layer and moving the magnetic media relative to themagnetic head layer to magnetically access the magnetic media.

In a further embodiment, a magnetic tape access system is providedcomprising a controller for a magnetic tape head. The system furthercomprises a magnetic tape head assembly comprising a base substrateconfigured to support a magnetic head layer, the magnetic head layerformed on the base substrate and configured to magnetically access themagnetic tape, a metallic layer formed over the magnetic head layer anddisposed between the magnetic head layer and the magnetic tape when themagnetic media is positioned for access by the magnetic head layer.

In some embodiments, the system further comprises a first reelconfigured to rotate a first corresponding reel of the magnetic tape ina cartridge enclosing the magnetic tape, a second reel configured torotate a second corresponding reel of the magnetic tape in the cartridgeenclosing the magnetic tape, and a plurality of guides for guiding themagnetic tape laterally over the magnetic tape head assembly as thefirst and second reels rotate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a magnetic media access head.

FIG. 2 illustrates a method of using the magnetic media access head.

FIG. 3 illustrates a magnetic media access head.

FIG. 4 illustrates a magnetic tape head.

FIG. 5 illustrates a magnetic tape head.

FIG. 6 illustrates a magnetic tape head.

FIG. 7 illustrates a cross section of a magnetic media access head.

FIG. 8 illustrates a magnetic disk drive.

FIG. 9 illustrates a magnetic tape access system.

DETAILED DESCRIPTION

The following description and associated figures teach the best mode ofthe invention. For the purpose of teaching inventive principles, someconventional aspects of the best mode may be simplified or omitted. Thefollowing claims specify the scope of the invention. Note that someaspects of the best mode may not fall within the scope of the inventionas specified by the claims. Thus, those skilled in the art willappreciate variations from the best mode that fall within the scope ofthe invention. Those skilled in the art will appreciate that thefeatures described below can be combined in various ways to formmultiple variations of the invention. As a result, the invention is notlimited to the specific examples described below, but only by the claimsand their equivalents.

FIG. 1 illustrates a profile view magnetic media access head 100.Magnetic media access head 100 includes base substrate 101, magnetichead layer 102, and metallic layer 103. FIG. 1 further illustratesmagnetic media 104 although magnetic media 104 may not always be presentwhen not being accessed by magnetic media head 100. FIG. 1 illustratesthat magnetic media 104 is touching magnetic head 100. However, in someembodiments, magnetic media 104 need not be touching magnetic head 100in order for magnetic head 100 to access magnetic media 104.Furthermore, FIG. 1 is not necessarily drawn to scale.

Base substrate 101 is configured to support magnetic head layer 102.Magnetic head layer 102 is formed on base substrate 101 and isconfigured to magnetically access magnetic media 104. Metallic layer 103is formed over magnetic head layer 102 and is disposed between magnetichead layer 102 and magnetic media 104 when magnetic media 104 ispositioned for access by magnetic head layer 102.

Magnetic media head 100 is illustrated in a profile view to show how thelayers are placed relative to one another. Therefore, magnetic mediahead 100 may take any other shape besides that shown in FIG. 1.Similarly, the shapes of base substrate 101, magnetic head layer 102,and metallic layer 103, individually, may take other shapes. Forexample, magnetic head layer 102 may be inset into base substrate 101and metallic layer 103 may be formed to cover both magnetic head layer102 and at least a portion of base substrate 101.

Base substrate 101 may be composed of aluminum oxide titanium carbide(AlTiC), calcium titanate (CaTiO₃), or other material that may supportmagnetic head layer 102. Magnetic head layer 102 may be composed ofnickel, iron, cobalt, zirconium, alloys thereof, or any other magneticmaterial that can be used to access magnetic information on magneticmedia 104. Magnetic head layer 102, though shown as a single contiguouslayer, may comprise multiple access elements. Magnetic media 104 maycomprise a segment of magnetic tape, a magnetic disk, or any other typeof magnetic media capable of storing information accessible by amagnetic media head. The information accessed on magnetic media 104 maybe analog, digital, some combination thereof, or any other format usedfor storing information on magnetic media.

Metallic layer 103 may be comprised of titanium, platinum, tungsten, orany metal or metal alloy that is formed on magnetic head layer 102 inorder to prevent wear on magnetic head layer 102 by other elements, suchas magnetic media 104 or atmospheric pollutants. For example, magneticmedia head 100 may comprise a magnetic tape head and magnetic media 104may comprise magnetic tape. Magnetic tape is positioned so that itcontacts the magnetic tape head and moves over the magnetic tape head inorder for the magnetic tape head to read information from or writeinformation to the magnetic tape. As it passes over the magnetic tapehead, the magnetic tape may erode the magnetic tape head until the headcan no longer function and needs to be replaced. Metallic layer 103provides a durable coating that helps prevent this wear on magnetic headlayer 102.

Conductive metals, in particular, provide the added benefit of shortingout any electromechanical corrosion effects that may occur whenaccessing magnetic media 104. Thus, metal will protect magnetic headlayer 102 from wear, erosion, and corrosion. Moreover, metal tends to bea more durable coating than the insulating materials that are typicallyused to protect magnetic media heads.

Metallic layer 103 may be applied to magnetic media head 100 usingchemical vapor deposition, atomic layer deposition, physical vapordeposition, ion beam deposition, plasma vapor deposition, or any othermethod of applying metallic material so that metallic layer 103 canperform as described herein.

In a preferred embodiment, metallic layer 103 is composed of metallictitanium. Titanium is a hard wearing, chemically stable, andelectrically conducting metal. When exposed to air, the outermost layerof titanium will form titanium dioxide. Titanium dioxide is a very hardmaterial that is not easily worn off by material, such as magnetic tape,abrasively rubbing against the titanium dioxide layer. If for somereason the titanium dioxide layer is worn off, the layer of titaniumunder the worn off layer will be exposed to the air and form a new layerof titanium dioxide. This process effectively allows titanium to repairitself and allows a metallic layer 103 made of titanium to protectmagnetic head layer 102 for much longer than current protective layers.

Advantageously, coating magnetic media head 100 with metallic layer 103protects magnetic head layer 102 from wear. This allows magnetic mediahead 100 to last longer before having to be replaced in comparison withmagnetic media head 100 being uncoated or even coated with a lessdurable insulator material.

In some embodiments, metallic layer 103 may be used to protect anoptical media head, such as an optical tape or optical disk head, or anyother type of media access head from wear.

FIG. 2 illustrates a method of operating magnetic media head 100 toaccess magnetic media 104. The method provides magnetic media head 100for accessing magnetic media 104 (step 200). Magnetic media head 100 maybe a magnetic tape read and/or write head, a magnetic disk head, such asa hard disk head, or a head for accessing any other type of magneticmedia. Similarly, magnetic media may be magnetic tape, a magnetic disk,such as a hard disk platter, or any other type of magnetic media.

Magnetic media 104 is positioned for access by magnetic head layer 102of magnetic media head 100 (step 202). For example, if magnetic mediahead 100 is a magnetic tape head, then magnetic media 104 is magnetictape that is positioned on magnetic media head 100 so as the tape istouching magnetic media head 100. In an alternative example, if magneticmedia head 100 is a hard disk head, then magnetic media 104 is a harddisk platter and magnetic media head 100 is placed close enough to thesurface of the platter that information can be read from or written tothe platter.

Once magnetic media head 100 and magnetic media 104 are positionedappropriately, magnetic media 104 is moved relative to magnetic headlayer 102 to magnetically access magnetic media 104 (step 204). In themagnetic tape example from above, this means that magnetic media 104 ismoved over magnetic media head 100 so that magnetic media head 100 canaccess various points along the length of the magnetic tape.Alternatively, in the hard disk example from above, magnetic media head100 is moved across the platter by an arm while the platter spins undermagnetic media head 100.

FIG. 3 illustrates a profile view of magnetic media access head 300.Magnetic media access head 300 includes base substrate 301, magnetichead layer 302, insulator layer 303, and metallic layer 304. FIG. 3further illustrates magnetic media 305 although magnetic media 305 maynot always be present when not being accessed by magnetic media head300. FIG. 3 illustrates that magnetic media 305 is touching magnetichead 300. However, in some embodiments, magnetic media 305 need not betouching magnetic head 300 in order for magnetic head 300 to accessmagnetic media 305. Furthermore, FIG. 3 is not necessarily drawn toscale.

Base substrate 301 is configured to support magnetic head layer 302.Magnetic head layer 302 is formed on base substrate 301 and isconfigured to magnetically access magnetic media 305. Insulator layer303 is formed over magnetic head layer 302 and metallic layer 304 isformed over insulator layer 303. Insulator layer 303 and metallic layer304 are disposed between magnetic head layer 302 and magnetic media 305when magnetic media 305 is positioned for access by magnetic head layer302.

Magnetic media head 300 is illustrated in a profile view to show how thelayers are placed relative to one another. Therefore, magnetic mediahead 300 may take any other shape besides that shown in FIG. 3.Similarly, the shapes of base substrate 301, magnetic head layer 302,insulator layer 303 and metallic layer 304, individually, may take othershapes. For example, magnetic head layer 302 may be inset into basesubstrate 301. Insulator layer 303 and metallic layer 304 may then beformed to cover both magnetic head layer 302 and at least a portion ofbase substrate 301.

Base substrate 301 may be composed of aluminum oxide titanium carbide(AlTiC), calcium titanate (CaTiO₃), or other material that may supportmagnetic head layer 302. Magnetic head layer 302 may be composed ofnickel, iron, cobalt, zirconium, alloys thereof, or any other magneticmaterial that can be used to access magnetic information on magneticmedia 305. Magnetic head layer 302, though shown as a single contiguouslayer, may comprise multiple access elements. Magnetic media 305 maycomprise a segment of magnetic tape, a magnetic disk, or any other typeof magnetic media capable storing information accessible by a magneticmedia head.

Metallic layer 304 may be comprised of titanium, platinum, tungsten, orany metal or metal alloy that is formed on magnetic head layer 302 inorder to prevent wear on magnetic head layer 302 by other elements, suchas magnetic media 305 or atmospheric pollutants. For example, magneticmedia head 300 may comprise a magnetic tape head and magnetic media 305may comprise magnetic tape. Magnetic tape is positioned so that itcontacts the magnetic tape head and moves over the magnetic tape head inorder for the magnetic tape head to read information from or writeinformation to the magnetic tape. As it passes over the magnetic tapehead, the magnetic tape may erode the magnetic tape head until the headcan no longer function and needs to be replaced. Metallic layer 304provides a durable coating that helps prevent this wear on magnetic headlayer 302.

Conductive metals, in particular, provide the added benefit of shortingout any electromechanical corrosion effects that may occur whenaccessing magnetic media 305. Thus, metal will protect magnetic headlayer from wear, erosion, and corrosion of magnetic head layer 302.Moreover, metal tends to be a more durable coating than the insulatingmaterials that are typically used to protect magnetic media heads.

Metallic layer 304 may be applied to magnetic media head 300 usingchemical vapor deposition, atomic layer deposition, physical vapordeposition, ion beam deposition, plasma vapor deposition, or any othermethod of applying metallic material so that metallic layer 304 canperform as described herein.

In a preferred embodiment, metallic layer 304 is composed of metallictitanium. Titanium is a hard wearing, chemically stable, andelectrically conducting metal. When exposed to air, the outermost layerof titanium will form titanium dioxide. Titanium dioxide is a very hardmaterial that is not easily worn off by material, such as magnetic tape,abrasively rubbing against the titanium dioxide layer. If for somereason the titanium dioxide layer is worn off, the layer of titaniumunder the worn off layer will be exposed to the air and form a new layerof titanium dioxide. This process effectively allows titanium to repairitself and allows a metallic layer 304 made of titanium to protectmagnetic head layer 302 for much longer than current protective layers.

Insulator layer 303 may be comprised of alumina, titanium dioxide,silicon nitride, aluminum nitride, silicon dioxide, or any othernon-conducting material. The inclusion of insulator layer 303 inmagnetic media head 300 is for applications of magnetic media head 300where the electrical integrity of magnetic head layer 302 should not becompromised. An exemplary application where insulator layer 303 isrequired is in magneto-resistive read devices that are often used inmagnetic tape heads. Therefore, if magnetic head layer 302 has one ormore magneto-restive read elements, alone or in combination with writeelements, magnetic head layer 302 will require insulator layer 303 inbetween magnetic head layer 302 and metallic layer 304.

It should be understood that, while magnetic media head 300 shows onlyinsulator layer 303 between magnetic head layer 302 and metallic layer304, there may exist additional layers between magnetic head layer 302and metallic layer 304.

FIG. 4 illustrates a profile view of magnetic tape head 400. Magnetictape head 400 includes cover plate 401, base substrate 402, and thinfilm magnetic structures 403. FIG. 4 further illustrates magnetic tape404 although magnetic tape 404 may not always be present when not beingaccessed by magnetic tape head 400. FIG. 4 illustrates that magnetictape head 400 has only two thin film magnetic structures 403 but someembodiments may have additional thin film magnetic structures formed inbase substrate 402 or other sections of base substrate formed on eitherside of base substrate 402. Furthermore, FIG. 4 is not necessarily drawnto scale.

Base substrate 402 may be composed of aluminum oxide titanium carbide(AlTiC), calcium titanate (CaTiO₃), or other material that may supportthin film magnetic structures 403. Cover plate 401 may be composed ofthe same material as base substrate 402 or may be composed of some othermaterial. Thin film magnetic structures 403 may be composed of nickel,iron, cobalt, zirconium, alloys thereof, or any other magnetic materialthat can be used to access magnetic information on magnetic tape 404.

In operation, magnetic tape 404 passes over tape head 400 as magnetictape moves from one tape reel to another. This allows thin film magneticstructures 403 to read data from or write data to the length of magnetictape 404. However, as magnetic tape 404 passes over tape head 400 thetape wears on the surface of thin film magnetic structures 403 and basesubstrate 402.

FIG. 5 illustrates a profile view of magnetic tape head 500. Similar tomagnetic tape head 400, magnetic tape head 500 includes cover plate 501,base substrate 502, and thin film magnetic structures 503. FIG. 5further illustrates magnetic tape 504 although magnetic tape 504 may notalways be present when not being accessed by magnetic tape head 500.FIG. 5 illustrates that magnetic tape head 500 has only two thin filmmagnetic structures 503 but some embodiments may have additional thinfilm magnetic structures formed in base substrate 502 or other sectionsof base substrate formed on either side of base substrate 502.Furthermore, FIG. 5 is not necessarily drawn to scale.

As discussed above, as magnetic tape 504 passes over tape head 500 thetape wears on the surface of thin film magnetic structures 503 and basesubstrate 502. This wear erodes thin film magnetic structures 503 andbase substrate 502 creating a gap 505 between thin film magneticstructures 503 and magnetic tape 504. As magnetic tape 504 erodes thinfilm magnetic structures 503, gap 505 gets larger and the distancebetween thin film magnetic structures 503 increases. At some point thedistance between thin film magnetic structures 503 and magnetic tape 504becomes too great for thin film magnetic structures 503 to write data toor read data from magnetic tape 504.

For example, for many modern magnetic tape head applications the gapbetween thin film magnetic structures 503 and magnetic tape 504 can be amaximum of 15 nanometers (nm) (up to 20 nm with some technologies) forthin film magnetic structures 503 to perform properly. As technologychanges, this cutoff distance may decrease thereby decreasing the amountof time that magnetic tape head 500 can be used before wearing out andneeding to be replaced.

FIG. 6 illustrates a profile view of magnetic tape head 600. Magnetictape head 600 includes cover plate 601, base substrate 602, thin filmmagnetic structures 603, insulator layer 604, and metallic layer 605.FIG. 6 further illustrates magnetic tape 606 although magnetic tape 606may not always be present when not being accessed by magnetic tape head600. FIG. 6 illustrates that magnetic tape head 600 has only two thinfilm magnetic structures 603 but some embodiments may have additionalthin film magnetic structures formed in base substrate 602 or othersections of base substrate formed on either side of base substrate 602.Furthermore, FIG. 6 is not necessarily drawn to scale.

Base substrate 602 may be composed of aluminum oxide titanium carbide(AlTiC), calcium titanate (CaTiO₃), or other material that may supportthin film magnetic structures 603. Cover plate 601 may be composed ofthe same material as base substrate 602 or may be composed of some othermaterial. Thin film magnetic structures 603 may be composed of nickel,iron, cobalt, zirconium, alloys thereof, or any other magnetic materialthat can be used to access magnetic information on magnetic tape 606.

In this embodiment, at least one of thin film magnetic structures 603 isa magneto-resistive read element and requires an insulator layer tooperate properly. Insulator layer 604 may be comprised of alumina,titanium dioxide, silicon nitride, aluminum nitride, silicon dioxide, orany other non-conducting material. Metallic layer 605 may be comprisedof titanium, platinum, tungsten, or any metal or metal alloy that isformed on magnetic head layer 603 in order to prevent wear on magnetichead layer 603 by other elements, such as magnetic media 606 oratmospheric pollutants.

In operation, as magnetic tape 606 passes over tape head 600, magnetictape 606 wears on metallic layer 605 rather than directly on thin filmmagnetic structures 603. Moreover, even if metallic layer 605 is everworn through, then magnetic tape 606 will have to wear through 604 aswell before wearing on thin film magnetic structures 603. Thus, the useof metallic layer 605 to protect the thin film magnetic structures 603greatly increases the amount of time before magnetic tape 606 wears thinfilm magnetic structures 603 to the point of failure.

FIG. 7 illustrates a profile view of magnetic media access head 700.Magnetic media access head 700 includes base substrate 701, thin filmmagnetic layer 702, insulator layer 703, and metallic layer 704. FIG. 7is not necessarily drawn to scale.

As discussed above, if thin film magnetic layer 702 is worn to the pointof being too far from the magnetic tape that thin film magnetic layer702 is accessing, then thin film magnetic layer 702 will not be able toread from or write to the magnetic tape. This same principle holds withregards to the distance between thin film magnetic layer 702 and themagnetic tape that is created by insulator layer 703 and metallic layer704. Therefore, the thickness of insulator layer 703 and metallic layer704 should not exceed the maximum distance from which thin film magneticlayer 702 is capable of accessing the magnetic tape.

In a preferred embodiment, insulator layer 703 and metallic layer 704are a combined 1 to 20 nm in thickness, as shown, while not exceedingthe maximum thickness that will still allow proper access to magnetictape by thin film magnetic layer 702. Insulator layer 703 and metalliclayer 704 can satisfy this thickness requirement using any ratio of thetwo layers, including a ratio where there is no insulator layer 703 andonly a metallic layer 704.

FIG. 8 illustrates a profile view of hard disk drive 800. Hard diskdrive 800 includes magnetic read/write heads 801 and platter 802.Magnetic read/write heads 801 are positioned over platter 802 using arm803.

As discussed above, magnetic media access heads are used in moreapplications than just magnetic tape. In the embodiment of FIG. 8,magnetic read/write heads are used in a hard disk drive application.While magnetic read/write heads 801 do not contact platter 802 whenaccessing data on platter 802, magnetic read/write heads 801 may stillphysically contact other parts during operation. For example, arm 803may rest magnetic read/write heads 801 on a surface when not accessingdata on platter 802. Therefore, it may still be beneficial for magneticread/write heads 801 to use a structure similar to that of magneticmedia access head 100 for wear protection.

FIG. 9 illustrates magnetic tape access system 900. Magnetic tape accesssystem 900 includes magnetic tape head 901, controller 902, tape guides903, tape reel 905, tape reel 906, and magnetic tape 907. Tape reel 905,tape reel 906, and magnetic tape 907 may be enclosed within tapecartridge 904 for ease of use. Elements 901-907 are shown in anexemplary configuration but may take other forms and include additionalelements. In some embodiments, magnetic tape access system 900 iscontained within an enclosure that accepts tape cartridges like those oftape cartridge 904. Furthermore, magnetic tape access system 900 may bepart of a robotic tape library that contains volumes of magnetic tapecartridges and additional magnetic tape access systems.

In some embodiments, tape cartridge 904 includes only a single tape reel905 and tape reel 906 is an empty reel external to tape cartridge 904.In operation, when tape cartridge 904 is placed into magnetic tapeaccess system 900, magnetic tape 907 is spooled from tape reel 905 ontoempty tape reel 906 for accessing information on magnetic tape 907.

Controller 902 comprises a microprocessor, microcontroller, applicationspecific integrated circuit (ASIC), or other control circuitry.Controller 902 may further comprise a memory device that storesoperating software, such as firmware, that controller 902 executes tooperate magnetic tape access system 900. Magnetic tape heads 100, 300,or 600 may be examples of magnetic tape head 901, though magnetic tapehead 901 may take other forms.

When tape cartridge 904 is inserted into tape access system 900,controller 902 directs actuators that move tape guides 903 to positionmagnetic tape 907 on magnetic tape head 901. Controller 902 then directselectric motors to spin reels that correspond to tape reels 905 and 906in cartridge 904 to pass magnetic tape 907 over magnetic tape head 901.The tape reels 905 and 906 may be able to spin in both directions sothat magnetic tape 907 can pass over magnetic tape head 901 in eachdirection. Controller 902 operates magnetic tape head 901 to read datafrom or write data to magnetic tape 907. Controller 902 may receive datafor writing to magnetic tape 907 from another system over acommunication link. Similarly, controller 902 may transfer data readfrom magnetic tape 907 to the other system over the communication link.

The above description and associated figures teach the best mode of theinvention. The following claims specify the scope of the invention. Notethat some aspects of the best mode may not fall within the scope of theinvention as specified by the claims. Those skilled in the art willappreciate that the features described above can be combined in variousways to form multiple variations of the invention. As a result, theinvention is not limited to the specific embodiments described above,but only by the following claims and their equivalents.

What is claimed is:
 1. A magnetic tape access system, comprising: acontroller for a magnetic tape head; a magnetic tape head assemblycomprising a base substrate configured to support a magnetic head layer,the magnetic head layer formed on the base substrate and configured tomagnetically access magnetic tape, and a non-magnetic metallic layerformed over the magnetic head layer and disposed as an outermost layeron the magnetic tape head assembly between the magnetic head layer andthe magnetic tape when the magnetic tape is positioned for access by themagnetic head layer.
 2. The magnetic tape access system of claim 1,further comprising: a first reel configured to rotate a firstcorresponding reel of the magnetic tape in a cartridge enclosing themagnetic tape; a second reel configured to rotate a second correspondingreel of the magnetic tape in the cartridge enclosing the magnetic tape;a plurality of guides for guiding the magnetic tape laterally over themagnetic tape head assembly as the first and second reels rotate.
 3. Themagnetic tape access system of claim 1, wherein the metallic layerprevents contact between the magnetic head layer and the magnetic tapeto prevent wear on the magnetic head layer.
 4. The magnetic tape accesssystem of claim 1, wherein the magnetic tape head assembly furthercomprises an insulator layer formed between the magnetic head layer andthe metallic layer.
 5. The magnetic tape access system of claim 1,wherein the metallic layer is composed of titanium, platinum, tungsten,or any other metal or metal alloy.
 6. The magnetic tape access system ofclaim 1, wherein the metallic layer is from 1 nanometer to 20 nanometersin thickness.
 7. The magnetic tape access system of claim 1, whereinmagnetically accessing the magnetic tape comprises reading data from orwriting data to the magnetic tape.